Memory array incorporating memory cells arranged in NAND strings

ABSTRACT

An exemplary NAND string memory array includes at least one plane of memory cells, said memory cells comprising thin film modifiable conductance switch devices and which cells are arranged in a plurality of series-connected NAND strings, and NAND strings including a series select device at each end thereof. Another exemplary NAND string memory array includes a group of more than four adjacent NAND strings within the same memory block each associated with a respective global bit line not shared by the other NAND string of the group. Another exemplary NAND string memory array includes NAND strings on identical pitch as their respective global bit lines.

CROSS-REFERENCE TO RELATED APPLICATION(S)

This application is related to co-pending U.S. application Ser. No.10/729,831 by En-Hsing Chen, et al, entitled “NAND Memory ArrayIncorporating Capacitance Boosting of Channel Regions in UnselectedMemory Cells and Method for Operation of Same,” filed on even dateherewith, which application is hereby incorporated by reference in itsentirety; to co-pending U.S. application Ser. No. 10/729,865 by En-HsingChen, et al., entitled “NAND Memory Array Incorporating Multiple SeriesSelection Devices and Method for Operation of Same,” filed on even dateherewith, which application is hereby incorporated by reference in itsentirety; and to co-pending U.S. application Ser. No. 10/729,844 byEn-Hsing Chen, et al, entitled “NAND Memory Array Incorporating MultipleWrite Pulse Programming of Individual Memory Cells and Method forOperation of Same,” filed on even date herewith, which application ishereby incorporated by reference in its entirety.

BACKGROUND

The present invention relates to semiconductor integrated circuitscontaining memory arrays, and in preferred embodiments the inventionparticularly relates to monolithic three-dimensional memory arrayshaving series-connected memory cells.

Recent developments in semiconductor processing technologies and memorycell technologies have continued to increase the density achieved inintegrated circuit memory arrays. For example, certain passive elementmemory cell arrays may be fabricated having word lines approaching theminimum feature size (F) and minimum feature spacing for the particularword line interconnect layer, and also having bit lines approaching theminimum feature width and minimum feature spacing for the particular bitline interconnect layer. Moreover, three-dimensional memory arrayshaving more than one plane or level of memory cells have been fabricatedimplementing such so-called 4F² memory cells on each memory plane.Exemplary three-dimensional memory arrays are described in U.S. Pat. No.6,034,882 to Johnson, entitled “Vertically Stacked Field ProgrammableNonvolatile Memory and Method of Fabrication.”

A variety of other memory cells technologies and arrangements are alsoknown. For example, NAND flash and NROM flash EEPROM memory arrays areknown to achieve relatively small memory cells. Other small flash EEPROMcells are known which use hot electron programming, such as NROM andfloating gate NOR flash memory arrays.

An extremely dense memory array may be achieved using a NAND-stylearrangement, which includes series-connected NAND strings of memory celldevices. Each NAND string of memory cells typically includes a firstblock select device which couples one end of the NAND string to a globalline, a plurality of series-connected memory cells, and a second blockselect device which couples the other end of the NAND string to a biasnode associated with the string. A memory array may include a number ofmemory blocks, with each block including a plurality of NAND stringswhich share the same word lines. Two block select signals for the blockare typically routed to each NAND string of the block.

A basic NAND string is a very efficient structure, capable of achievinga 4F² layout for the incremental transistor memory cell. Density is alsoimproved because the block select lines may be routed in continuouspolysilicon stripes across the array block, just like the word lines,without any provision being otherwise required for contacting a blockselect signal line to some but not all of the block select transistorsformed in the NAND strings.

For many NAND string memory arrays (i.e., those employingseries-connected memory cells), tradeoffs exist when choosing thevarious bias voltages applied to selected and unselected memory cellsduring programming, and the relative timing of the application of thesevoltages. Conditions must be chosen to ensure adequate programming ofthe selected memory cells, but also to ensure that unselected memorycells within the selected NAND string are not unintentionally “disturbprogrammed” and further to ensure that memory cells in an unselectedNAND string adjacent to the selected NAND string (i.e., sharing the sameword lines) are also not unintentionally disturbed during programming.Despite progress to date, continued improvement in memory arraystructures and methods of their operation are desired. Moreover,improvements in such memory array structures which may be fashioned intoa three-dimensional memory array are highly desired.

SUMMARY

An exemplary NAND string memory array includes at least one plane ofmemory cells, said memory cells comprising thin film modifiableconductance switch devices and which cells are arranged in a pluralityof series-connected NAND strings, said NAND strings including a seriesselect device at each end thereof. Another exemplary NAND string memoryarray includes a group of more than four adjacent NAND strings withinthe same memory block each associated with a respective global bit linenot shared by the other NAND string of the group. Another exemplary NANDstring memory array includes NAND strings on identical pitch as theirrespective global bit lines. In certain exemplary embodiments, a memoryarray includes series-connected NAND strings of memory cell transistorshaving a charge storage dielectric, and includes more than one plane ofmemory cells formed above a substrate.

The invention in several aspects is particularly suitable forimplementation within an integrated circuit, including those integratedcircuits having a memory array, for memory array structures, for methodsfor operating such integrated circuits and memory arrays, and forcomputer readable media encodings of such integrated circuits or memoryarrays, all as described herein in greater detail and as set forth inthe appended claims. A wide variety of such integrated circuits isspecifically contemplated, including those having a three-dimensionalmemory array formed above a substrate, having memory cells formed oneach of several memory planes (i.e., memory levels).

The foregoing is a summary and thus contains, by necessity,simplifications, generalizations and omissions of detail. Consequently,those skilled in the art will appreciate that the foregoing summary isillustrative only and that it is not intended to be in any way limitingof the invention. Other aspects, inventive features, and advantages ofthe present invention, as defined solely by the claims, may be apparentfrom the detailed description set forth below.

BRIEF DESCRIPTION OF THE DRAWINGS

The present invention may be better understood, and its numerousobjects, features, and advantages made apparent to those skilled in theart by referencing the accompanying drawings.

FIG. 1 depicts a portion of a non-mirrored NAND string memory arrayconfiguration in accordance with certain embodiments of the presentinvention.

FIG. 2 depicts a portion of a mirrored NAND string memory arrayconfiguration in accordance with certain embodiments of the presentinvention.

FIG. 3 is a schematic diagram representing a particular NAND string of amirrored array.

FIG. 4 is a diagram of waveforms for accomplishing capacitive boostingof a non-selected NAND string channel when programming an adjacent NANDstring, in accordance with certain embodiments of the present invention.

FIG. 5 is a diagram of multi-level waveforms for accomplishingcapacitive boosting of a non-selected NAND string channel whenprogramming an adjacent NAND string, in accordance with certainembodiments of the present invention.

FIG. 6 is a diagram of dual pulse multi-level waveforms foraccomplishing capacitive boosting of a non-selected NAND string channelwhen programming an adjacent NAND string, in accordance with certainembodiments of the present invention.

FIG. 7 is a diagram of a sequence of multiple dual-pulse multi-levelwaveforms for accomplishing capacitive boosting of a non-selected NANDstring channel when programming an adjacent NAND string, in accordancewith certain embodiments of the present invention.

FIG. 8 is a graph depicting the amount of disturb programming of anunselected memory cell in an unselected NAND string, relative to thepassing voltage on unselected word lines, for three different caseswhich vary the number of programming pulses used to program an adjacentNAND string, for an exemplary mirrored NAND string configuration.

FIG. 9 is a graph depicting the amount of disturb programming ofunselected memory cells in an unselected NAND string, relative to thepassing voltage on unselected word lines, for a first NAND stringutilizing two series select devices at the bottom of the string, and fora second NAND string utilizing three series select devices at the bottomof the string.

FIG. 10 is a graph depicting the amount of disturb programming of anunselected memory cell in an unselected NAND string, relative to thepassing voltage on unselected word lines, for a first case correspondingto programming an adjacent NAND string, and for a second casecorresponding to an inhibited NAND string, both cases utilizing a singleselect device at the bottom of the respective string.

FIG. 11 is a graph depicting the amount of disturb programming of thebottom-most unselected memory cell in an unselected NAND string,relative to the passing voltage on unselected word lines and relative tothe voltage of a bottom select device, for a NAND string utilizingmultiple series select devices at the bottom of the string, each suchdevice driven by a respective signal having different voltages.

FIG. 12 is a graph depicting the amount of programming of thebottom-most selected memory cell in a selected NAND string, relative tothe passing voltage on unselected word lines, for a NAND stringutilizing multiple series select devices at the bottom of the string,each such device driven by a respective signal having differentvoltages.

FIG. 13 is a schematic diagram representing a particular NAND string ofa non-mirrored array.

FIG. 14 depicts a portion of a non-mirrored NAND string memory arrayconfiguration incorporating multiple series selection devices at one endof each string, in accordance with certain embodiments of the presentinvention.

FIG. 15 is a perspective view of a multi-level array structure usefulfor embodiments of the present invention, showing series-connected NANDstrings of SONOS memory cell devices.

FIG. 16 is a block diagram of an integrated circuit incorporating amemory array in accordance with the present invention.

FIGS. 17A, 17B, 17C, 17D, and 17E depict various layout arrangementsuseful in certain memory array configurations.

FIG. 18 depicts an arrangement of a mirrored NAND string arrangementhaving two shared drain lines for a memory block.

The use of the same reference symbols in different drawings indicatessimilar or identical items.

DETAILED DESCRIPTION

Referring now to FIG. 1, an electrical schematic is shown of a portionof an exemplary memory array 100. The portion shown may represent atwo-dimensional array having only one plane of memory cells, or mayrepresent one level of three-dimensional memory array having more thanone level (i.e., more than one plane) of memory cells. A plurality ofseries-connected NAND transistor strings 102, 104, 106 are shown. Eachstring includes a plurality of SONOS transistors connected in series,each gated by a respective one of a plurality of word lines 117. TheNAND string 102 also includes a block select device 114 for coupling oneend of the NAND string to a global bit line 103 in accordance with ablock select signal TOP SELECT conveyed on node 113, and furtherincludes a second block select device 116 for coupling the other end ofthe NAND string to a shared bias node 101 in accordance with a blockselect signal BOTTOM SELECT conveyed on node 115.

Each NAND string 102, 104, 106 are disposed within the same block withinthe memory array, and each is respectively coupled to its associatedglobal bit line 103, 105, 107. Such global bit lines may be conveyed bya wiring level below the array, or alternatively above the array, oralternatively on a wiring level within the array (e.g., in athree-dimensional array having more than one level). The NAND strings102, 104, 106 may be referred to as “adjacent” NAND strings, as theyshare the same word lines (i.e., within the same block of the array),even though they do not share global bit lines. For the arrangementshown, the shared bias node 101 may also be known as a global sourceline.

The block select signals TOP SELECT and BOTTOM SELECT, the word lines117, and the global source line 101 all traverse across the memory arrayin the same direction (for convenience, here shown as horizontally), sothat they may be more conveniently decoded and driven to appropriatelevels, as described below. The global bit lines 103, 105, 107 traverseacross the memory array generally in an orthogonal direction (forconvenience, here shown as vertically). Only four such passing wordlines 111 and one selected word line 109 are depicted, but it should beappreciated that in practice each NAND string may include many such wordlines, such as 16 total word lines.

As described above, the memory cells in the NAND strings (i.e., thosegated by one of the word lines) are preferably SONOS structures. As usedherein, the term SONOS is used broadly and is meant to refer to thegeneral class of transistor devices having a charge storage dielectriclayer between the gate and the underlying channel, and is not used in arestrictive sense to merely imply a literalsilicon-oxide-nitride-oxide-silicon layer stack. For example, otherkinds of charge storage dielectric layers may be employed, such asoxynitrides, as well as other kinds of memory cell structures, as isdescribed in greater detail herebelow.

A basic NAND string is a very efficient structure, capable of achievinga 4F² layout for the incremental transistor memory cell. Density is alsoimproved because the two block select lines 113, 115 may be routed incontinuous polysilicon stripes across the array block, just like theword lines, without any provision being otherwise required forcontacting a block select signal line to some but not all of the blockselect transistors formed in the NAND strings.

Another factor contributing to the efficiency of this array structure isthe ability of the block select devices to be fabricated identically tothe memory cell devices. In other words, the block select devices may beSONOS devices just like the memory cell devices. In 3D array embodimentshaving more than one memory level formed above a semiconductorsubstrate, each memory level consequently includes only one type ofdevice, further simplifying the fabrication of each level. The blockselect devices may be sized identically to the memory cell devices, butin certain embodiments may have a longer channel length (i.e., widerpolysilicon stripe for the block select signals) to increase thebreakdown voltage of the block select devices. In other embodiments theblock select lines could be normal TFT MOS devices without a chargestorage dielectric. This would add process complexity but would allowbetter optimizing the select devices for lower leakage.

In a preferred embodiment, the memory cell devices and block selectdevices are both SONOS devices which are implanted to shift the thermalequilibrium (i.e., minimum trapped negative charge in the nitride)threshold voltage V_(T) to depletion mode. A depletion mode implant thatis a slow diffuser, preferably antimony or arsenic, is preferably usedbecause of the relatively higher diffusion of such dopants in apolycrystalline layer compared with a crystalline substrate, and alsodue to the extremely small dimensions of the devices. The erased stateV_(T) is substantially depletion mode, preferably −2V to −3V threshold,while the programmed state V_(T) is preferable about zero volts. Thememory cells are programmed or erased to one of the two thresholdvoltages according to the data state, but the block select devices arepreferably programmed to have about a one-volt threshold voltage andmaintained in this programmed state. Suitable fabrication methods aredescribed in U.S. application Ser. No. 10/335,089 by Andrew J. Walker,et al, entitled “Method for Fabricating Programmable Memory ArrayStructures Incorporating Series-Connected Transistor Strings,” filed onDec. 31, 2002, which application is hereby incorporated by reference inits entirety.

In the descriptions that follow, assume that the NAND string 102 isselected for programming, and that memory cell 108 is to be programmed.The global bit line 103 associated with the selected NAND string 102(i.e., the selected global bit line) is typically brought to (or heldat) ground. The TOP SELECT signal and the other word lines between theselected memory cell 108 and the select device 114 (i.e., the “passing”word lines) are driven to a high enough voltage to turn each respectivedevice on and thereby couple the global bit line voltage to the channelof the selected memory cell 108. Then, the word line 109 associated withthe selected memory cell 108 (i.e., the selected word line) is typicallydriven to a high level programming voltage, such as about 13 V (forcertain embodiments). Consequently, a programming stress is developedacross the selected memory cell (here labeled as an “S” cell) that isequal in magnitude to the word line programming voltage (i.e., V_(PROG))minus the selected channel voltage (e.g., ground), and which programmingstress is developed for a time equal to the length of the programmingpulse applied to the selected word line, to program the selected cell.

Other memory cells associated with the selected word line, such asmemory cell 112, experience the same word line programming voltage butshould be inhibited from being programmed. Such a cell 112 is“half-selected” and may be termed as “H” cell. To inhibit programming ofthe H cell 112, the global bit line 105 associated with the unselectedNAND string 104 (i.e., the inhibited global bit line) is typicallybrought to a voltage between ground and the program voltage (e.g., apositive voltage less than the programming voltage) which may be termedan inhibit voltage. The TOP SELECT signal and the passing word linesbetween the unselected memory cell 112 and the select device 118 aredriven to a high enough voltage to turn each respective device on andthereby couple the inhibit voltage to the channel of the half-selectedmemory cell 112. When the selected word line 109 is driven to theprogramming voltage, the stress developed across the half-selectedmemory cell is much less than the programming stress on the selectedcell, and programming is inhibited. For example, if an inhibit voltageof 6 V is coupled to the half-selected memory cell, the “disturb” stresson the half-selected cell 112 is equal in magnitude to the word lineprogramming voltage (i.e., V_(PROG)) minus the selected channel voltage(e.g., 6V), and which disturb stress is developed for a time equal tothe length of the programming pulse applied to the selected word line.

As may be appreciated, a tradeoff exists in the selection of the inhibitvoltage V_(INH) and the passing word line voltage V_(PASS). As the valueof these voltages approach the programming voltage, the disturb stressapplied to the half-selected memory cell is reduced, and such cells aremuch less prone to unintentional programming (i.e., V_(INH) disturb).However, with such a high passing word line voltage, other memory cellswithin the selected NAND string 102 (such as “F” cell 110) are morelikely to be unintentionally programmed because their channels are atground just like the selected memory cell (i.e., V_(PASS) disturb).Desirable structures and operating conditions achieve a balance betweenthese two competing phenomena. In addition, driving such large circuitnodes to voltages typically higher than the upper power supply voltagereceived by an integrated circuit consumes considerable power andrequires large circuit structures to accomplish. In addition, the “U”cell 120 is effected by both the V_(INH) and the V_(PASS) voltage. It isdesirable to keep the V_(INH) and V_(PASS) voltages within one or twovolts of each other so the voltage stress across the U cells is only oneor two volts. The U cell is stressed for a larger number of cycles thaneither the F cell or the H cell and thus benefits from a low stressvoltage.

Such a balance may be more easily achieved by using a lower inhibitvoltage and a lower passing word line voltage (at least during the wordline programming pulse), and capacitively coupling (i.e., “boosting”)the channel of an H cell to a higher voltage during the selected wordline programming pulse. As a result, the stress across the F cells isreduced because the passing word line voltage is lower, and yet thestress across the H cell is also reduced because its channel is boostedin the direction of the selected word line programming pulse to avoltage closer to the selected word line than its initial bias voltage.Since the capacitance between word line and TFT channel is relativelyhigh (compared to floating gate approaches), and the capacitance betweenthe TFT channel and “ground” is relatively low (compared to NAND stringsfabricated in a semiconductor substrate (i.e., bulk approaches)), aninversion layer of a device in an inhibited string can be capacitivelyboosted very effectively.

An advantage of NAND strings formed in dielectric isolated TFT channelstripes is a lack of field leakage currents between physically adjacentNAND strings. However, biasing an unselected NAND string to a highvoltage, especially if one or more channels therein are capacitivelycoupled and left floating, leaves the string more susceptible to largefield-enhanced leakage currents in thin film transistor (TFT) devicesthat are supposed to be off, such as block select device 119 within theunselected NAND string 104, and block select device 116 in the selectedNAND string. Since these two devices share a common drain node and acommon gate node, some choices of gate and drain voltages create a sneakpath that can lead to large power dissipation, further restricting thechoices of voltage on the gate and drain. Such a condition aggravatesleakage from the NAND strings and may lead to a partial programming(i.e., “soft” programming) of memory cells within the unselectedstrings. Exemplary circuit structures and methods are describedherebelow to successfully reduce such effects.

However, before describing such structures and methods, an additionalNAND string arrangement is useful to describe. Referring now to FIG. 2,a schematic diagram is depicted of a mirrored NAND string arrangement160 in which two different NAND strings in each of two blocks arecoupled to the same global bit line. Again, the portion shown mayrepresent a two-dimensional array having only one plane of memory cells,or may represent one level of three-dimensional memory array having morethan one plane of memory cells.

In the descriptions that follow, the upper left NAND string is assumedto be the selected NAND string. The selected word line 168 is driven toa V_(WL) voltage, and the selected memory cell 169 is indicated by an“S.” Other non-selected word lines 166 in the same block as the selectedword line 168 may be termed “passing” word lines because these areusually driven to a V_(WLPASS) voltage suitable to pass current throughits respective memory cell 167 irrespective of the stored data state inits respective memory cell 167. Only two such passing word lines 166 andone selected word line 168 are depicted, but it should be appreciatedthat in practice each NAND string may include many word lines, such as16 total word lines.

One end of the selected NAND string is coupled to a global bit line 162by select device 165 which is controlled by a block select signalconveyed on node 164 having a voltage at any given time known as theV_(BSELB) voltage, which signal may be thought of as the block selectsignal coupling the selected NAND string to the global bit line. Theother end of the selected NAND string is coupled to a shared bias node172 by select device 171 which is controlled by a block select signalconveyed on node 170 having a voltage of V_(BSELD), which signal may bethought of as the block select signal coupling the selected NAND stringto the shared drain line. The voltage of the shared drain line 172 maybe known as the V_(DRAIN) voltage.

Another NAND string (not shown) within the block just above the selectedblock is also coupled to the global bit line 162 by a select device 173which is controlled by a block select signal conveyed on node 176 havinga voltage at any given time known as the V_(UNBSEL) voltage, whichsignal may be thought of as an unselected block select signal. The twoselect devices 173 and 165 preferably share a global bit line contact.

An adjacent NAND string is also depicted just to the right of theselected NAND string. As stated above, such adjacent NAND strings atleast share the same word lines, and in this arrangement are coupled tothe same global bit line (although by two different block selectedsignals) but do not share the same shared bias node (i.e., shared“drain” node). Here the adjacent NAND string includes devices 181, 183,185, and 187. The lower end of this adjacent NAND string is coupled tothe global bit line 162 by select device 187 which is controlled by theblock select signal conveyed on node 170, here referred to as V_(BSELD).The upper end of this adjacent NAND string is coupled to a shared biasnode 174 by select device 181 which is controlled by the block selectsignal conveyed on node 164, V_(BSELB). The voltage of the shared drainline 174 may be known as the V_(DADJ) voltage, representing the drainvoltage for an adjacent NAND string.

As with the arrangement shown in FIG. 1, the memory cell in the selectedNAND string that is coupled to the selected word line (e.g., cell 169)is an “S” cell, the memory cells in the selected NAND string that arecoupled to a passing word line (e.g., cells 167) are “F” cells, thememory cell in the unselected (adjacent) NAND string that is coupled tothe selected word line (e.g., cell 185) is an “H” cell, and the memorycells in the unselected NAND string that are coupled to a passing wordline (e.g., cells 183) are “U” cells. Such half-selected (H) andunselected (U) memory cells are found in other non-selected NAND stringsacross the selected memory block. The bias conditions of these four celltypes are analogous to those of the non-mirrored arrangement shown inFIG. 1.

Additional description of this mirrored arrangement 160, includingexemplary operating conditions for reading, programming, and erasingmemory cells within such an array, may be found in “Method forFabricating Programmable Memory Array Structures IncorporatingSeries-Connected Transistor Strings,” by Walker, et al., referred toabove. In a programming operation, an inhibited (unselected) NAND stringis depicted in FIG. 3 in which the selected memory cell within theselected NAND string (not shown, but which shares the same global bitline) is either programmed by driving the global bit line to ground, oris inhibited from programming by driving the global bit line to a bitline inhibit voltage, V_(INH) or V_(INHIBIT). For convenience, the morecolloquial node names shown are used to facilitate comparisons herebelowwith similar techniques for non-mirrored NAND string arrays and thevisual presentation of the NAND string is drawn to suggest a biasingwith a higher V_(INH) voltage at the top of the string, and a lowervoltage at the bottom end of the string, to which a leakage current mayflow through the bottom selection device(s). As used herein, a “blockselect device,” an “access device” and a mere “select device” are allused interchangeably, and consequently a “block select signal,” an“access signal” and a mere “select signal” are also all usedinterchangeably.

One method of boosting the channel of an H cell within this mirroredNAND string memory array is depicted in FIG. 4. Assume briefly that allmemory cells have the same threshold voltage. Further assume that theBottom Access select device (e.g., device 187 in FIG. 3, and device 119in FIG. 1) is off so that, even if the adjacent global bit line is atground (for programming the selected NAND string), no current will flowthrough the bottom select device. (As will be described below, such isnot necessarily the case.) The drain node at the top of the inhibitedNAND string is brought to the inhibit voltage V_(INH), and the selectedand passing word lines are all brought to a passing word line voltageV_(PASS). All of the source/drain nodes within the NAND string, as wellas the channels of the top select device and the memory cell devices,are all brought to a threshold voltage below the V_(INH) voltage(assuming the V_(PASS) voltage minus a memory cell threshold voltage isgreater than the V_(INH) voltage minus the select device threshold).Moreover, at this point the access device turns off, thereby decouplingthe NAND string channels from the shared drain node which conveys theV_(INH) voltage.

The selected word line is then driven from the V_(PASS) voltage furtherupward to the V_(PGM) voltage (also described herein as the V_(PROG)voltage), which couples the H-cell channel upward to a voltage higherthan its initial bias level. If all the memory cell devices are turnedon, all the channels along the string are still electrically coupled tothe H memory cell channel, and all such channels will be capacitivelycoupled until one or more of the memory cell devices turns off. At thatpoint, the channels “beyond” the turned-off memory cell (i.e., channelsfarther away from the H memory cell) are decoupled from any furtherincrease in the boosted voltage. Any other channels, including the Hcell itself, may be additionally boosted until the selected word linereaches its high level. One device will have the highest threshold andstop the voltage rise of the rest of the string further from the globalbit line. Since some cells could have lower threshold than others (somebeing programmed and some being erased) an unknown number of cellchannels along the string may still be electrically connected to thesource of the H cell and that entire region will be boosted. As aresult, the boosted voltage of the H cell channel is reduced by havingto ‘drag’ additional channels upward in voltage.

Even though a number of cell channels along the string may still beelectrically connected to the source of the H cell, the channel isboosted because the select device is turned on momentarily to set thepotential of the inhibited NAND string's inversion layer at a thresholdvoltage below the V_(DRAIN) potential, and then it turns off to decouplethe inversion layer from the shared drain node. Once the H-cell channelis boosted, the resultant potential across the tunnel oxide in the Hcell is therefore low enough to inhibit programming. For this exemplaryembodiment, if there are N memory cells in the string, then N−1 of theword lines (i.e., memory cell gates) are driven to the passing voltageand the selected word line is further driven to the programming voltageafter a delay to allow for the channel bias to establish itself alongthe string.

In certain embodiments, the inhibit voltage V_(INH) and the Top Accesssignal voltage (which, in this exemplary mirrored arrangement, is alsothe control gate of the access device connecting the adjacent NANDstring to the grounded global bit line) may be set to a relatively lowvoltage and still turn on sufficiently to provide an adequate connectionpath to the grounded global bit line. For example, if these accessdevices have a threshold voltage of around 0V, then the high level ofthe block select signal (e.g., here the Top Access signal voltage) mayhave an exemplary value between approximately 1V and 3.3V (e.g., the VDDvoltage), the word line passing voltage may ramp from 0V up toapproximately 5V, and the word line programming voltage may ramp from 0Vto the passing voltage and then to approximately 13V. In some preferredembodiments, the memory cells in a NAND string are programmedsequentially from the “bottom” of the string (furthest away from itsassociated global bit line) to the top of the string so that all Fmemory cells “above” the S cell in the string are in the low Vt state(preferably a negative Vt state). Doing so allows a lower passing wordline voltage to be used while still providing sufficiently good couplingof the selected memory cell channel region to the grounded global bitline for adequate programming to occur. Moreover, this lower passingvoltage guards against unintentional F-cell program disturb (i.e., aV_(PASS) disturb) because the stress across such devices is much lessthan across the S-cell being programmed.

Boosting the channels of unselected NAND strings as described thus farreduces H-cell disturb, but additional reduction may be desired. This isparticularly true for scaled technologies with shorter channel lengthsand/or thinner gate oxides, and may allow for even higher programmingvoltages that are desirable to improve programming performance withoutnegatively impacting disturb programming of unselected NAND strings.Further protection for the H cells also allows additional cells alongthe word line, because more programming cycles on a given word line areacceptable before a logic one (e.g., a deliberately unprogrammed) statefrom a previous write cycle, which become the victim H cells for laterprogramming cycles, are disturbed.

Because the devices in the string may be either programmed orun-programmed (i.e., resulting in a variation of threshold voltages indevices in the string), the image charge does not always stay just underthe H cell but can spread along the channel. This results in widevariations in the boosted voltage of an H-cell. Also, leakage paths mayoccur in the select devices (known as “field enhanced leakage current”which may be particularly noticeable in TFT devices relative to bulkdevices) which may cause boosted voltage levels in an unselected channelstring to leak away at the bottom of the string. A similar leakagecurrent may exist in an “off” select device at the bottom of a selectedNAND string, which can flow into the selected string through the bottomselect device, thereby increasing the voltage of the string at thebottom and reducing programming efficiency (particularly for cellsfurthest from the global bit line because of the voltage gradient alongthe string) and increasing power dissipation.

The protection against H-cell disturb can be improved by decoupling theremainder of the string from the H-cell, and allowing the H-cell channelto be boosted to a greater voltage (assuming, for this description, apositive programming pulse on the selected word line). For example, thetop select device may be turned on to set the initial bias of theinversion channels along the inhibited NAND string, as before. Thedevice then turns off to decouple the channel from the inhibit voltage.Before the selected word line is driven to the programming voltage, theword lines on either side of the selected cell are also dropped involtage to turn off the memory cell devices on either side of theselected memory cell, thus decoupling the H-cell channel from theremainder of the string. Then, when a programming pulse is applied tothe selected word line (i.e., when it is driven from a voltage, such asthe passing voltage, to the programming voltage), the H-cell channel isboosted to a higher voltage than before, and less program disturb on theH-cell results.

There are many operating conditions which may be utilized to accomplishsuch enhanced boosting of just the H-cell channel. The passing word lineon either side of the selected word line may be brought to ground, andthe remaining word lines left at a passing voltage. In the selected NANDstring to be programmed, even with ground on the adjacent passing wordlines, the programming bit line voltage (ground) may still be passed tothe selected cell by using a sequential programming scheme in a string,which assures that the F-memory cell on the bit line side of theselected cell (i.e., one of the adjacent cells whose word line isgrounded) is in its erased state and has a preferable threshold voltageclose to −3V.

Referring now to FIG. 5, representative waveforms for an exemplarytechnique are depicted to accomplish such decoupling, irrespective ofthe programmed or erased status of individual memory cells. Here, theTop Access select signal and all word lines are initially driven to avoltage nominally equal to the inhibit voltage V_(INH) plus a thresholdvoltage, here shown as approximately 7 volts (for an exemplaryembodiment). This condition fairly quickly biases the entire string atthe V_(INH) voltage, shown here as 6V. Then, the Top Access signal andthe word lines other than the selected word line are dropped to a lowerpassing voltage V_(PASS), here shown as approximately 4V. This decouplesthe H-cell channel from the inhibited NAND string. Then the selectedword line is driven from the initial bias level (e.g., 7V) upward to thefull programming voltage, here shown as 13V, to program the selectedcell. The H-cell channel is boosted to a voltage even closer to theprogramming voltage than before (e.g., for the exemplary positiveprogramming pulse shown, boosted to an even higher voltage than before).As may be appreciated, the word lines are driven to an initial levelthat is high enough to initially bring the unselected string channels tothe inhibit voltage (through any combination of programmed andun-programmed cells) and then dropped in voltage by at least the maximumVt variation of cell devices to isolate the H cell in spite of thethreshold variations. Using a lower passing voltage during theprogramming pulse also has the advantage of reducing the stress on Fcells in the selected string, which cells can otherwise be disturbedfrom an erased state by a high V_(PASS) voltage while the selectedstring is pulled to ground for programming the S cell.

As long as the V_(PASS) voltage is less than the V_(INH) voltage plus athreshold of an erased memory cell, the neighboring cells around theH-cell will be turned off and the string decoupled from the H-cellbefore the programming pulse. Moreover, this passing voltage may be anyvalue greater than the bit line programming voltage (e.g., ground) plusthe threshold of an erased cell (e.g., −2V or −3V). For example, apassing voltage of ground may be adequate in some embodiments. In theselected NAND string to be programmed, the bit line programming voltage(ground) is passed to the selected cell even with ground on the wordlines around it since a preferred sequential programming scheme ensuresthat any memory cells on the bit line side of the selected memory cell(i.e., between the selected cell and the select device coupled to thebit line) are still in the erased state. The gate of the select device,which is preferably kept programmed to at least a slight positivethreshold voltage (Vt), is preferably driven to a voltage higher thanits Vt plus the inhibit voltage so it is not the first device in thestring to shut off (e.g., so that the V_(INH) voltage is passed to theNAND string memory cells).

As depicted in FIG. 5, the signals conveyed to the unselected word linesand to the top select device are respective multilevel pulses, drivenfirst to a higher voltage and then to a lower voltage. Alternatively, asdepicted in FIG. 6, two sequential pulses may be used, the first onedriven to a higher voltage, and the second one driven to a lowervoltage. In either case, it is preferable that the selected word line isbrought back to at least the V_(PASS) voltage before the unselected wordlines are brought down, to reduce out coupling near the selected memorycell.

In certain cases, additional protection against H cell disturb isdesired. This is particularly true for scaled technologies with shorterchannel lengths and or thinner gate oxides, and may also provide forhigher programming voltages that are desirable to improve programmingperformance. Moreover, in spite of the assumptions thus far in thesedescriptions that the select device at the bottom of the unselectedstring is turned off, this is frequently not the case. Such a selectiondevice, even with ground on its gate terminal, may still leak enough todischarge the channels within an inhibited string, particularly if thechannels were boosted to (and remain floating at) at relatively highlevel, and even more particularly for TFT devices (which may exhibitmore leakage than a bulk device).

As depicted in FIG. 7, an exemplary set of programming waveforms aredepicted in which multiple cycles of these multi-level pulses (as shownin FIG. 6) are employed. By so doing, each individual pulse is muchshorter than before, and any leakage current through the bottom selectdevice has less time to discharge the string. With each pulse, theinitial bias within the string is re-established, and then the string(or at least the H-cell channel) is capacitively boosted. The result isa channel that remains more nearly at its peak boosted voltage whenpulsed repeatedly with many shorter pulses than if pulsed once with amuch longer pulse, especially for the cell closest to the bottom accessdevice and when the other side of the access device is at ground (as ina mirrored configuration when programming the adjacent string). For aselected cell, programming is unaffected by the use of a large number ofshorter pulses as long as the aggregate programming stress time isunchanged. Exemplary programming pulses may be less than 1 microsecondin duration, and a corresponding aggregate programming time longer than10 microseconds. Exemplary programming voltage is within the range from10 to 16 volts, and preferably around 13 V.

FIG. 8 shows the effects of multiple pulse programming on programdisturb for an exemplary NAND string technology in a mirroredconfiguration. The assumptions are a string whose channels wereinitially biased to an inhibit voltage of 5V minus the threshold voltageof the top selection device 181. The top selection device 181 is off,and the bottom selection device 187 is biased assuming the global bitline 162 is conveying a grounded bit line programming voltage to theadjacent NAND string. The graph depicts the amount of disturb shift inH-cell threshold voltage as a function of the passing voltage V_(PASS)presented to the unselected word lines during the programming pulse, forseveral different numbers of programming pulses (each case having thesame aggregate time). As may be observed for any given case, higherV_(PASS) voltages result in higher disturb programming because ofgreater leakage through the bottom selection device. In addition, usingmore programming pulses greatly reduces the disturb programming (i.e.,when keeping the aggregate programming time constant). For example,using a V_(PASS) voltage of 4V, a single programming pulse of 1.2milliseconds duration results in a 1.05V threshold shift in the H-cell,whereas using 60 pulses of 20 microsecond duration results in a 0.34Vthreshold shift, and using 240 pulses of 5 microsecond duration resultsin a 0.2V threshold shift.

The field enhanced leakage current, particularly of TFT devices, may bereduced by using multiple series selection devices rather than a singleselection device at one or both ends of a NAND string. FIG. 9 shows theeffect of memory cell location on program disturb for an exemplary NANDstring technology in a mirrored configuration using, in one case, twoseries selection devices at each end of the string, and in another case,three series selection devices at the bottom end of the string. Theassumptions are again a string whose channels were initially biased toan inhibit voltage of 5V. The top selection devices 201 are off, and thebottom selection devices are biased assuming the global bit line isconveying a grounded bit line programming voltage to the adjacent NANDstring. The graphs depicts the amount of disturb shift in H-memory cellthreshold voltage as a function of the passing voltage V_(PASS)presented to the unselected word lines during the programming pulse, forseveral different memory cell positions along a string of 18 totaldevices. In each case, a total of 240 programming pulses were applied.As may be observed, having three series section devices 204 results inreduced disturb programming compared to having only two such seriesselection devices 202. Also, memory cells closer to the bottom of a NANDstring exhibit greater program disturb.

With multiple series selection gates, program disturb is further reducedalbeit with a penalty of increasing die size because of the additionalseries devices needed on each string. Moreover, the string current,I_(ON), will also be reduced (for a given size memory cell device andselect device).

While the previous two cases illustrated multiple series selectiondevices having the same voltage on both (or all three) of the seriesdevices at an end of the NAND string, the leakage current may be furtherreduced by independently biasing the respective gate of each seriesdevice. Having ground on both gates does not result in the lowestleakage. Referring to FIG. 10, two cases are shown. The NAND string 210on the left has a bottom selection device 212 biased with ground on itsgate and ground on its source (corresponding to a programming voltage onthe adjacent string in a mirrored configuration). The NAND string 220 onthe right has a bottom selection device 222 biased with 5V on both itsgate and source. The leakage current through the bottom selection device212 is clearly seen in the graph 214 of disturb programming versusV_(PASS) voltage. The grounded-gate device 212 has higher leakagecurrent because of field enhanced leakage current which is caused by thehigh drain to source potential experienced on the bottom-mosttransistor. Although the inhibited NAND string 220 bottom select device222 is biased acceptably with a voltage such as 5V on its gate (sinceits source is also at 5V), impressing a voltage such as 5V on the gateof the bottom access device on a selected NAND string is unacceptablebecause such a string may be coupled at its opposite end to ground (ifthe selected cell is to be programmed).

If multiple series selection devices are used, multiple gate voltagesmay be used to reduce the leakage current. One or more of the multipleselect devices may have a higher voltage, such as 4V to 5V, on its gatein order to reduce field enhanced leakage current most effectively. Sucha select device gate voltage may also be the same value as the V_(PASS)voltage, but also may be set to a different value. At least one of thegates should be at a voltage lower than the Vt of the access device toshut off leakage current flowing into the selected string (e.g., for amirrored arrangement). In certain preferred arrangements, the accessdevice which has a grounded gate is the bottom one because itsgate-to-source voltage is the least negative, and a more negativegate-to-source voltage would increase field enhanced leakage current. Incertain mirrored embodiments, the “source voltage” at the bottom of aNAND string is the adjacent global bit line, which may be at eitherground or a V_(INH) voltage. For certain preferred embodiments, threeseries select devices may be used to reduce the leakage currents andprovide for adequate disturb programming protection, especially for veryscaled devices.

FIG. 11 shows the program disturb of the last memory cell 231 as afunction of the V_(PASS) voltage and the gate voltage of the lower-mostbottom selection device 233. The gate voltage of the upper-most bottomselection device 232 is held at ground, and the NAND string 230 isbiased with an inhibit voltage V_(INH) coupled to both ends of thestring to inhibit programming. Very low disturb and wide programmingconditions are achieved.

FIG. 12 shows the programmability of the last memory cell 231 as afunction of the gate voltage of the lower-most bottom selection device233, when the NAND string 230 is biased for programming. The gatevoltage of the upper-most bottom selection device 232 is held at ground,and the NAND string 230 is biased with a programming voltage of groundon the global bit line (i.e., node 234) coupled to the top end of thestring, and the inhibit voltage V_(INH) coupled to the bottom end of thestring. As can be appreciated in FIG. 12, the programmability of thebottom-most cell 231 on the selected string 230 is not negativelyaffected by changes in the gate voltage of the lower-most bottomselection device 233.

Much of the previous description is phrased in the context of exemplarymirrored configurations, such as that shown in FIG. 2. Much of thenomenclature used in these figures and descriptions, however, may beapplicable to non-mirrored configurations as well, such as that shown inFIG. 1. For example, the top end of the NAND string (i.e., the topselect device(s)) has been generally used to correspond to the end of aNAND string coupled to an inhibit voltage, while the bottom end of theNAND string (i.e., the bottom select device(s)) generally correspond toa connection to an array line that may be biased at a low voltage, suchas ground, that may cause an unintentional and unwanted leakage currentflowing from the unselected NAND string into the array line.

Referring now to FIG. 13, a non-mirrored NAND string 250 is depicted.Here a single top access device 252 couples one end of the string to theglobal bit line 251, which may be at ground to program a cell when thestring 250 is selected, or at the inhibit voltage V_(INH) to inhibitprogramming in a selected or unselected NAND string. A single bottomaccess device 254 couples the other end of the string 250 to the globalsource line 253, which may be left to float during programming of aselected block, or preferably may be biased at an intermediate voltagebetween ground and the inhibit voltage, which intermediate voltage ismore preferably approximately half of the inhibit voltage.

An improved embodiment is depicted in FIG. 14, which shows anon-mirrored string arrangement 300 (i.e., having adjacent stringsconnected to respective global bit lines at the same end), having asingle block select device (also known as an array select device, orsimply a select device) at the global bit line end of the strings (hereshown as the top), and having multiple series select devices at the endopposite the global bit line end of the strings (here shown as two suchselect devices at the bottom end).

The top select devices 114, 118 do not play a significant role in theleakage prevention because they are on for both a programmed NAND string302 and an inhibited NAND string 304. Therefore a single top selectdevice may be used and still achieve best-case program disturb reductionof an inhibited NAND string and best-case programming of a programmedNAND string. The top select devices 114, 118 are needed for isolatingthe global bit line from unselected memory blocks also associated withthe global bit line. Each unselected memory block (such as, for example,block 310) has a respective top select signal (e.g., select signal 312)which is preferably at ground to decouple each NAND string (e.g., NANDstring 314) within the respective unselected memory block from theirassociated global bit lines. Moreover, the word lines in each unselectedmemory block (e.g., word lines 316) are also preferably at ground tokeep such blocks inactive, powered-down, and unprogrammed. Since someglobal bit lines will be at the V_(INH) voltage (to program cells withina selected block) the channels of the NAND strings in these unselectedblocks could leak upward. However, this leakage is self-limiting becauseit reduces the drain-to-source voltage of the “leaky” select device(e.g., device 318) as the unselected NAND string begins to rise (e.g.,channel node 319), while also decreasing the gate-to-source voltage ofthe select device, further limiting the leakage current. The potentialfor disturb of the first cell in the strings of these unselected blocksis minimal because the disturb is in the direction to reduce the Vt (theerase direction, since the source voltage is higher than the gatevoltage) which is much slower than programming operations (at least forcertain of the structures contemplated herein).

The inherent voltage drop that must be stopped by the “off” accessdevices at the bottom of the NAND strings is the difference betweenV_(INH) plus the desired capacitive boosting of the H-channel, and thelowest possible global bit line voltage, which is ground (to program acell). In a mirrored configuration this potential difference can occuracross a single string, as described above. But in exemplarynon-mirrored configurations the shortest path from a channel at theboosted V_(INH) level to a global bit line at ground involves two NANDstrings, as the path has to traverse through the shared source node atthe bottom of the strings. Consequently, the total leakage currentthrough the series combination of the bottom selection devices of aninhibited string (e.g., devices 119A, 119B) and the bottom selectiondevices of a programmed string (e.g., devices 116A, 116B) may be reducedby biasing the global source node 101 (i.e., shared source node) at anintermediate voltage. A shown, the shared source node is preferablydriven to a bias voltage between ground and the V_(INH) voltage, andmore preferably is driven to approximately 4V–5V for an exemplaryV_(INH) voltage of 6–7V.

Because field enhanced leakage current is a possible concern to both theinhibited string and the selected string, it is desirable to use such anintermediate voltage rather than the V_(INH) voltage on this sharedsource node 101. The preferred magnitude of the shared source node ischosen to balance the negative effects of leakage from an inhibitedstring and the negative effects of leakage into the programmed string.If the shared source node 101 is too low, the field enhanced leakagecurrent flowing from the inhibited string 304, which is integratedduring the relatively long program pulses, discharges the boosted levelof the string. If the shared source node 101 is too high, leakagecurrent may flow into the selected string 302 during a programmingpulse, and result in a degraded program voltage (i.e., loss of a solidground level) in the string, particularly for the bottom-most memorycell 303, which reduces the effective program voltage developed acrossthe cell. This effect is less of a problem than the loss of boostedlevel, since this leakage current is small and, even with a high totalresistance through the string, the other end is coupled to ground. Thus,the selected string 302 can tolerate some leakage, although preferablythe gate of at least one of the bottom access devices 116A, 116B remainsbelow the threshold voltage of the access device to be able to turn offsuch a device. In certain embodiments, the upper bottom select signalBOT ACCESS A is preferably above ground (e.g., approximately 5V), whilethe lower bottom access signal BOT ACCESS B is preferably ground. Assuch, the Select B signal being at ground shuts off the selected NANDstring 302 leakage path, and the Select A signal at V_(INH) in serieswith the Select B at Vss (i.e., ground) still shuts off the fieldenhanced leakage path sufficiently enough to allow self boosting on theunselected string 304. As with other embodiments described herein, thisconfiguration performs better when multiple programming pulses are used,with multi-level pulses on the passing word lines and the top accesssignal, and may be used to achieve both sufficiently low disturbprogramming and low power programming. Preferably a large number of NANDstrings within a select memory block are simultaneously programmed toreduce the accumulated disturb on inhibited strings. For example, 64 to128 strings may be programmed at the same time within a memory blockhaving, for example, 256 to 1024 NAND strings.

In certain embodiments, all the passing word lines of NAND stringswithin a selected block are driven with the same passing voltage orpassing voltage waveform (which, as described herein, may be amulti-level waveform). In other embodiments, it may be desirable todrive the passing word lines “below” the selected word line (i.e., onthe opposite side of the selected word line relative to the global bitline) with a lower voltage than those passing word lines “above” theselected word line. The programming voltage (e.g., ground) is stillapplied robustly to the selected memory cell because the “upper”unselected word lines (i.e., those between the selected memory cell andthe select device(s) coupled to the global bit line) are driven with thehigher V_(PASS) voltage. But this arrangement reduces the F-cellprogramming stress on the lower memory cell devices (i.e., the so-calledV_(PASS) disturb stress). For embodiments incorporating mirrored NANDstrings, the top of one NAND string is the bottom of its adjacent NANDstring, and thus the top and bottom reverse 50% of the time, so that theF-cell stress is halved for all cells. For embodiments incorporatingnon-mirrored NAND strings, the respective bottom of each NAND string arealigned, and so cells toward the bottom would indeed see less V_(PASS)stress than cells toward the top. Nevertheless, the bottom cells may bemore susceptible to leakage-current induced H-cell program disturb(i.e., V_(INH) disturb) when its NAND string is unselected (since theyare closer to the end having the selection device(s) which may leak),and the boosting loss, even though reduced by these techniques, is notzero. As a result, non-mirrored NAND string arrays also benefit from thebottom cells getting less F-cell stress because these bottom cells cantolerate the higher H-cell stress without exceeding a total Vt changedue to all disturb mechanisms.

In certain embodiments, a multi-level memory array includes memory cellsformed on each of several memory planes or memory levels. NAND stringson more than one layer may be connected to global bit lines on a singlelayer. Such a global bit line layer is preferably disposed on a layer ofa monolithic integrated circuit below all the memory levels for moreconvenient connection to support circuitry for the memory array, whichmay be disposed in the substrate below the array. In some embodimentssuch a global bit line layer may reside in the midst of the memorylevels, or above the array, and more than one global bit line layer maybe used. Moreover, the NAND strings on more than one layer may also beconnected to shared bias nodes on a single layer, which preferably isdisposed above all the memory levels. In some embodiments, the sharedbias nodes may reside in the midst of the memory levels, or below thearray. The shared bias nodes may likewise be disposed on more than onelayer.

Since the non-mirrored NAND string arrangement depicted utilizes aglobal bit line for each adjacent NAND string, the pitch of global bitlines may be tighter than for other embodiments in which adjacent NANDstrings share the same global bit line. To alleviate global bit linepitch problems, in certain embodiments global bit lines may be routed ontwo or more wiring layers. For example, even-numbered NAND strings maybe associated with global bit lines disposed on one global bit linelayer, while odd-numbered NAND strings may be associated with global bitlines disposed on another global bit line layer. Vias may be staggeredto help match the pitch of NAND strings, and the required global bitline pitch relaxed to twice the pitch of individual NAND strings.Vertical vias that contact more than two vertically adjacent layers mayalso be used, particularly for three-dimensional arrays having more thanone memory plane of NAND strings. Such a vertical connection may also beconveniently termed a “zia” to imply a via-type structure connectingmore than one layer in the z-direction. Preferred zia structures andrelated methods for their formation are described in U.S. Pat. No.6,534,403 to Cleeves, issued Mar. 18, 2003, the disclosure of which ishereby incorporated by reference in its entirety. Additional details ofexemplary zias are described by Roy E. Scheuerlein, et al, in“Programmable Memory Array Structure Incorporating Series-ConnectedTransistor Strings and Methods for Fabrication and Operation of Same,”referenced above.

A variety of embodiments are contemplated. Both mirrored andnon-mirrored configurations, as described herein, are specificallycontemplated. Additional sharing may be employed to further reduce thearea required by any given block. For example, the contacts to theglobal bit lines in a non-mirrored configuration may be shared by twomemory blocks, one on either side of the shared contacts. In addition,the shared drain line and its associated contacts to the end of NANDstrings in one block may be shared by the NAND strings in the adjacentblock. In other embodiments, adjacent blocks may have independent shareddrain nodes to avoid stressing the unselected blocks.

As shown in FIGS. 17A, 17B, 17D, and 17E, compact arrangements of ziasin a straight line are preferred to save area for the contacts to theglobal bit lines. This is especially advantageous for the non-mirroredarrangement of NAND strings shown in FIGS. 17A, 17B and 17C. Any knownprocessing technique for producing zias at a very tight spacing of theNAND channel regions can be used in combination with the NAND stringarrangements shown in FIGS. 17A, 17B, 17D, and 17E. In FIG. 17A thenon-mirrored NAND strings are connected to global bit lines on a singlelayer below the memory lines and coincident with the memory lines sothey do not appear in the FIG. 17A plan view. Alternatively, zia 1701could connect to global bit lines on one layer while adjacent zia 1702could connect to global bit line on a second global bit line layer. Avertically overlapping zia technique that forms a zia connection from acommon memory level to two wiring levels may be used advantageously toconnect the NAND strings to global bit lines on two layers, as shown inarrangement 17B. Such vertically overlapping zia techniques aredescribed in more detail in U.S. patent application Ser. No. 10/728,451by Roy E. Scheuerlein, et al., entitled “High Density Contact to RelaxedGeometry Layers,” filed on even date herewith, which application ishereby incorporated by reference in its entirety. The two global bitline layers can both be below the memory array or both above the memoryarray. In FIG. 17C, the zia locations are staggered to enlarge thespacing between the zia holes and in some embodiments provide for a padregion on the NAND string channel layers and global bit line layers. Theuse of in-line zias (as shown in FIG. 24, FIG. 25, and FIG. 28 of“Method for Fabricating Programmable Memory Array StructuresIncorporating Series-Connected Transistor Strings,” referenced above)can also provide a tighter spacing of zias in the arrangements shown inFIGS. 17A, 17B, 17D, or 17E, while connecting the zia to a NAND stringin a selected block and a NAND string in an adjacent block. Multi-layervertical zia holes (as shown in FIG. 29 of “Method for FabricatingProgrammable Memory Array Structures Incorporating Series-ConnectedTransistor Strings,” referenced above) form compact zias which are alsosuitable for each of these arrangements.

As shown in FIG. 18, a mirrored string arrangement 1800 in a selectedblock of NAND strings has all adjacent NAND strings 1811, 1812, 1813,1814, 1815 connected to corresponding global bit lines 1801, 1802, 1803,1804, 1805 but at alternating sides of the memory block. The drain biasnode 1820 at the top and the drain bias node 1821 at the bottom may bebiased independently of the global bit line voltages and at a preferredvoltage for reducing leakage current from the stings as in non-mirroredNAND string arrangements. The global bit lines could be on one layer oron two layers, and above or below the memory layers.

The various techniques described herein, such as channel boosting,multiple programming pulses, multi-level pulses, and multiple seriesselection devices, may be used alone or in combination to reduce H-cellprogram disturb, F-cell program disturb, and to provide for robustS-cell programming.

For a mirrored configuration, a preferred embodiment uses three seriesselection devices on each end of each string, with two independent gatevoltages for the top select group and two independent gate voltages forthe bottom select group. Multi-level gate pulses are also used, with aninitial pulse level of (V_(INH)+max Vt), followed by a reduced pulselevel of (V_(INH)−min Vt), for both the top selector and the passingword lines. Multiple programming pulses are preferably used as well, allas summarized in the following table:

total # of Top selectors Bottom selector Common H cell F cell devicesper V_(INH) (3 gates) V_(PASS) V_(PGM) (3 gates) drain disturb disturbstring 5 V 7 V -> 4 V 7 V -> 13 V Outer 2 gates 0 V <250 mV <200 mV 22 4V shorted @ 0 V & inner 1 gate @ 4.5 V

A total of 22 devices are used per string: 16 memory cells; 3 seriesselection devices at the top of the string; and 3 series selectiondevices at the bottom of the string. The multi-level pulses on passingword lines and the top selection devices are initially 7V, and thenbrought down to 4V before the programming pulse is applied to theselected word line.

For a non-mirrored configuration, one preferred embodiment uses a singleselection device on the top end of each string (i.e., the global bitline end), and two series selection devices on the bottom end of eachNAND string, with two independent gate voltages for the bottom selectgroup. Multi-level gate pulses are also used, with an initial pulselevel of (V_(INH)+max Vt), followed by a reduced pulse level of(V_(INH)−min Vt), for both the top selector and the unselected wordlines. Multiple programming pulses are preferably used as well, assummarized in the following table:

total # of Top selectors Bottom selector Source H cell F cell devicesper V_(INH) 1 gate V_(PASS) V_(PGM) (2 gates) (GSL) disturb disturbstring 5 V 7 V -> 4 V 7 V -> 13 V outer gate @ 5 V & 2.5 V <75 mV <100mV 19 4 V inner gate @ 0 V

A total of 19 devices are preferably used per string: 16 memory cells; 1selection device at the top of the string; and 2 series selectiondevices at the bottom of the string. The multi-level pulses on passingword lines and the top selection devices are initially 7V, and thenbrought down to 4V before the programming pulse of is applied to theselected word line.

In certain non-mirrored embodiments, each NAND string may include only asingle select device at each end thereof, as depicted in FIG. 1.Suitable performance may be achieved using a preferable set of operatingconditions is described in the following table, which indicates voltageranges for the various signals in the array. The “Value” columnindicates a preferred value.

READ PROGRAM ERASE Signal Value Range Value Range Value Range V_(WL) 1 V  0 V . . . 3 V 12 V   7 V . . . 15 V  0 V 0 V V_(WLPASS) 5 V   2 V . .. 6 V  7 V   2 V . . . 9 V  0 V 0 V V_(WLUNSEL) 0 V   0 V or Floating  0V   0 V or Floating 10 V 6 V . . . 13 V or Floating V_(BSELB) 5 V   2 V. . . 6 V  5 V   4 V . . . 10 V 10 V 6 V . . . 13 V V_(BSELD) 5 V   2 V. . . 6 V  0 V −3 V . . . 0 V 10 V 6 V . . . 13 V V_(UNBSEL) 0 V −3 V .. . 0 V  0 V −3 V . . . 0 V 10 V 6 V . . . 13 V V_(GBL) 1 V   0 V . . .3 V 0 V/4 V   0 V/4 V . . . 10 V 10 V 6 V . . . 13 V V_(DRAIN) 1.5 V    0 V . . . 3 VV  4 V   4 V . . . 10 V or Floating 10 V 6 V . . . 13 V

In certain embodiments, the shared drain line may be common for allmemory blocks. In other embodiments, this common node (also describedherein as a global source line for non-mirrored configurations) may besplit into multiple nodes, and each independently biased. As manyunselected NAND strings are connected to the same wordline (usuallyNst=128 to 1024 (512 typ.) multiplied by the number of layers, Nla=2 to8 (8 typ.)), the leakage of all the “off” block select transistors(Nst*Nla) is superimposed to the read current of an erased cell.Indicating with Ibsleak the leakage of an unselected string, with Icerthe current of an erased cell and with Icpgm the current of a programmedcell, in order to correctly distinguish an erased cell from a programmedcell, the following equation must be satisfied:

${I_{cer} > {{Ratio}\left( {{I_{bsleak}N_{st}N_{la}} + I_{cpgm}} \right)}}->{I_{bsleak} < \frac{\frac{I_{cer}}{Ratio} - I_{cpgm}}{N_{st}N_{la}} \cong {1\mspace{14mu} p\; A}}$

With typical values of Ratio=100, Icer=500 nA, Icpgm=1 nA, Nst=512, andNla=8.

If the block select transistors leak more than the limit set by theequation above, the number of strings, Nst, may be reduced. The drawbackof this is that the array efficiency gets worst, as every time the arrayis broken, inefficiencies are introduced. Alternatively, the common biasnode may be split into multiple nodes. The V_(DRAIN) that contains theselected string may be biased at a normal V_(DRAIN) voltage (e.g.,1.5V). All the other V_(DRAIN) nodes may be biased at the same voltageas the global bit lines. In this way, even if the block select devicesare leaky, no current can flow in the unselected strings with V_(DRAIN)at 1V, since there is no voltage difference across the strings. If thecommon node is split M times (i.e., into M individual nodes), therequirement on Ibsleak is reduced by a factor of M with respect to thelimit above, without having to break the global bit line. A preferablevalue of M can be 128, giving a limit for Ibsleak of 150 pA. The rangefor M is preferably 16 to 512, depending on the block select transistorleakage.

The read biasing conditions described above set the global bit lines assources and the common node as a drain. The opposite is also possible;reversing the bias conditions of the two (e.g., the global bit lines at1.5V and the common node at 1V).

A possible variation to relax the requirement of having on-pitch zias onevery layer is to share the zias for two strings. This implies havingstrings pointing in opposite direction, like the adjacent stringdepicted in FIG. 2. In other embodiments, rather than having on-pitchzias, another routing layer (R4) may be introduced on top of the memoryarray. Such a routing layer would carry half of the global bit lines,while the other global bit line layer would carry the other half of theglobal bit lines.

As described above, for many memory arrays, and especially for athree-dimensional (3D) memory, utilizing depletion mode devices whenerased and near depletion mode devices (i.e., around one volt V_(T),such as, for example, 0.5 to 1.5V) when programmed has a great advantagein simplifying the layout complexity for each of the memory layers, asdescribed herebelow. Moreover, utilizing near depletion mode deviceswhen programmed reduces the voltages that need to be applied to theunselected word lines when reading a selected memory cell. The cellcurrent can pass more easily through the string even if unselectedmemory cells are programmed. This voltage reduction is beneficial forreducing disturb effects during the many expected read cycles. Forexample, an unselected memory cell on an unselected NAND string which iserased could be slowly disturbed to a programmed state by highervoltages on the word lines.

NAND strings in accordance with the present invention may be fabricatedusing any of a number of different processes. An integrated circuit mayinclude a memory array having a single memory plane, or may include amemory array having more than one memory planes. One exemplary structureis depicted in FIG. 15. A three-dimensional view is shown conceptuallydepicting a portion of a two-level memory array 400 in accordance withthe present invention. On level 1, a plurality of channel stripes (e.g.,402) is formed in a first direction. A stored charge dielectric layer404, such as an oxide/nitride/oxide (ONO) stack, is formed at least onthe top surface of the channel stripes 402. A plurality of gate stripes(e.g., 406) running in a second direction different than the firstdirection is formed on the stored charge dielectric layer 404.Preferably the gate stripes, also called word line stripes, rungenerally orthogonally to the channel stripes. A source/drain region(e.g., 410) is formed in the channel stripes in the exposed regionsbetween the word line stripes (i.e., not covered by a word line stripe),thus forming a series-connected string of thin-film transistors (TFT).

Such channel stripes 402 are preferably formed by depositing anamorphous silicon layer and etching the layer using a channel mask toform the channel stripes and annealing the layer to form a thin filmtransistor channel. The word line stripes 106 may be formed of a stackof more than one layer, such as a polysilicon layer covered by asilicide layer, or may be a three level stack, as shown in the figure.

An interlevel dielectric layer 408 is formed above the word line stripesto isolate the word lines on one level (e.g., word line stripes 406depicted on level 1) from the channel stripes on the next higher level(e.g., channel stripes 402 depicted on level 2). A dielectric may alsobe used to fill spaces between the word line stripes of a given level.As can be appreciated, such a structure forms a plurality ofseries-connected transistors within each channel stripe 402.

The transistors of such a NAND string may be fabricated to containenhancement or depletion mode devices for the programmed state. In othertypes of NAND memory arrays using floating gate devices (rather thanSONOS devices), the erased state is often a zero-volt threshold voltage(V_(T)) or even a depletion mode V_(T). A floating gate device can havea wide range of V_(T′)s because the floating gate can store a wide rangeof charge levels. Such a depletion mode programmed state is described in“A Negative Vth Cell Architecture for Highly Scalable, ExcellentlyNoise-Immune, and Highly Reliable NAND Flash Memories” by Takeuchi etal., in IEEE JSSC, Vol. 34, No. 5, May 1999, pp. 675–684.

The descriptions herein have focused on the programming of memory cells,and have not addressed reading or erasing operations. In exemplaryconfigurations, a selected NAND string is generally read by impressing avoltage across the NAND string, ensuring that both groups of one or moreblock select devices are biased to pass a current, ensuring that allnon-selected memory cell devices in the NAND string are biased to pass acurrent through the string irrespective of the data state storedtherein, and biasing the selected word line so that current flowsthrough the NAND string for only one of the two data states. All thememory cells in a selected block may be erased by impressing asufficiently high magnitude negative gate-to-source voltage across eachmemory cell transistor. For example, the global bit lines, any sharedbias nodes, all block select lines, and all word lines may be driven toan erase (V_(EE)) voltage of, for example, 10 volts. After allowing timefor the intermediate nodes in the selected block to charge tosubstantially the erase voltage conveyed on the global bit lines andshared drain nodes, the word lines in the selected block are brought toground to impress an erase bias across each memory cell in the block.Additional details of both reading and erasing mirrored configurationsare described in “Programmable Memory Array Structure IncorporatingSeries-Connected Transistor Strings and Methods for Fabrication andOperation of Same,” by Roy E. Scheuerlein, et al, already referencedabove, and analogous techniques may be employed for non-mirroredconfigurations.

One or more of the block select devices in embodiments described hereinmay be biased at times with a negative gate-to-source voltage. This putsa partial erase bias on such a block select device. If these blockselect devices are formed by the same process steps as a programmablecell, such as a depletion mode SONOS cell, these block select devicescan get partially “erased” by this bias voltage applied duringprogramming of a selected memory cell, which would slowly decrease theV_(T) of the block select devices into a negative region after a numberof program cycles. Such a threshold voltage may prevent the block selectdevice from being turned off.

One could use extra processing to remove the charge storage dielectriclayer (e.g., nitride) from the block select devices, or to fabricateanother type of select device different than the memory cell device, butthis adds complexity to the semiconductor process. Alternatively, apost-programming biasing condition is preferably added at the end ofeach program cycle, where the affected block select device is“programmed” a small amount to bring its V_(T) back up to its maximumof, for example, about 0 volts. This may be accomplished by returningall the word lines in a selected block back to ground (0 volts), takingthe global bit lines and shared drain nodes (or global source node) toground, and driving the respective select signal to the programmingvoltage for a short time. For convenience, all the block select signalsmay be driven to the programming voltage as there is little concern forover-programming the threshold of the block select devices. For anexemplary SONOS process, the erase time is much longer than theprogramming time, so that even a relatively short “block select V_(T)adjust program time” is adequate to ensure that its V_(T) stays at itsmaximum. An exemplary duration of time for such a block select V_(T)adjust is approximately 1 μs.

Referring now to FIG. 16, a block diagram is shown of an integratedcircuit 500 including a memory array 502, which diagram may be useful torepresent various embodiments of the present invention. In one suchembodiment, the memory array 502 is preferably a three-dimensional,field-programmable, non-volatile memory array having more than one plane(or level) of memory cells. The array terminals of memory array 502include one or more layers of word lines organized as rows, and one ormore layers of global bit lines organized as columns. A group of wordlines, each residing on a separate layer (i.e., level) and substantiallyvertically-aligned (notwithstanding small lateral offsets on somelayers), may be collectively termed a row. The word lines within a rowpreferably share at least a portion of the row address. Similarly, agroup of global bit lines, each residing on a separate layer andsubstantially vertically-aligned (again, notwithstanding small lateraloffsets on some layers), may be collectively termed a column. The globalbit lines within a column preferably share at least a portion of thecolumn address.

The integrated circuit 500 includes a row circuits block 504 whoseoutputs 508 are connected to respective word lines of the memory array502. The row circuits block 504 receives a group of M row addresssignals, various control signals 512, and typically may include suchcircuits as row decoders and array terminal drivers for both read andwrite (i.e., programming) operations. The row circuit block can alsoinclude circuits for controlling the block select lines and shared drainbias lines to determine block selection by some of the M row addresssignals. The integrated circuit 500 also includes a column circuitsblock 506 whose input/outputs 510 are connected to respective global bitlines of the memory array 502. The column circuits block 506 receives agroup of N column address signals, various control signals 512, andtypically may include such circuits as column decoders, array terminalreceivers, read/write circuitry, and I/O multiplexers. Circuits such asthe row circuits block 504 and the column circuits block 506 may becollectively termed array terminal circuits for their connection to thevarious terminals of the memory array 502.

Integrated circuits incorporating a memory array usually subdivide thearray into a sometimes large number of smaller arrays, also sometimesknown as sub-arrays. As used herein, an array is a contiguous group ofmemory cells having contiguous word and bit lines generally unbroken bydecoders, drivers, sense amplifiers, and input/output circuits. Anintegrated circuit including a memory array may have one array, morethan one array, or even a large number of arrays. An used herein, anintegrated circuit memory array is a monolithic integrated circuitstructure, rather than more than one integrated circuit device packagedtogether or in close proximity, or die-bonded together.

While any of a variety of semiconductor processes may be advantageouslyutilized to fabricate memory arrays having NAND strings, manyembodiments described above contemplate memory cells formed as thin filmtransistors above a semiconductor substrate. Preferred methods forfabricating such memory arrays are described in: U.S. application Ser.No. 10/334,649, filed on Dec. 31, 2002, by Andrew J. Walker, et al.,entitled “Formation of Thin Channels for TFT Devices to Ensure LowVariability of Threshold Voltages,” which application is herebyincorporated by reference; U.S. application Ser. No. 10/079,472, filedon Feb. 19, 2002, by Maitreyee Mahajani, et al., entitled “GateDielectric Structures for Integrated Circuits and Methods for Making andUsing Such Gate Dielectric Structures,” which application is herebyincorporated by reference; U.S. application Ser. No. 10/335,089 byAndrew J. Walker, et al, entitled “Method for Fabricating ProgrammableMemory Array Structures Incorporating Series-Connected TransistorStrings,” filed on Dec. 31, 2002, which application is herebyincorporated by reference in its entirety; and U.S. application Ser. No.10/668,693 by Maitreyee Mahajani, et al, entitled “Storage LayerOptimization of a Non Volatile Memory Device,” filed on Sep. 23, 2003,which application is hereby incorporated by reference in its entirety.Other useful fabrication methods are described in U.S. Patentapplication Ser. No. 10/728,437 by James M. Cleeves, et al., entitled“Optimization of Critical Dimensions and Pitch of Patterned Features Inand Above a Substrate,” filed on even date herewith, which applicationis hereby incorporated by reference in its entirety, and described inU.S. Patent application Ser. No. 10/728,436 by Yung-Tin Chen, entitled“Photomask Features with Interior Nonprinting Window Using AlternatingPhase Shifting,” filed on even date herewith, which application ishereby incorporated by reference in its entirety.

As used herein, a series-connected NAND string includes a plurality ofdevices connected in series and sharing source/drain diffusions betweenadjacent devices. As used herein, a memory array may be a twodimensional (planar) memory array having a memory level formed in asubstrate, or alternatively formed above the substrate. The substratemay either be a monocrystalline substrate, such as might include supportcircuitry for the memory array, or may be another type of substrate,which need not necessarily include support circuitry for the memoryarray. For example, certain embodiments of the invention may beimplemented utilizing a silicon-on-insulator (SOI) structure, and othersutilizing a silicon-on-sapphire (SOS) structure. Alternatively, a memoryarray may be a three-dimensional array having more than one plane ofmemory cells (i.e., more than one memory level). The memory levels maybe formed above a substrate including support circuitry for the memoryarray. As used herein, an integrated circuit having a three-dimensionalmemory array is assumed to be a monolithic integrated circuit, ratherthan an assembly of more than one monolithic integrated circuit.

The present invention is contemplated for advantageous use with any of awide variety of memory array configurations, including both traditionalsingle-level memory arrays and multi-level (i.e., three-dimensional)memory arrays, and particularly those having extremely dense X-line orY-line pitch requirements. Moreover, the invention is believed to beapplicable to memory array having series-connected NAND strings whichutilize modifiable conductance switch devices as memory cells, and isnot to be limited to memory cells incorporating a charge storagedielectric. Such modifiable conductance switch devices arethree-terminal devices whose conductance between two of the terminals ismodifiable, and further is “switched” or controlled by a signal on thethird or control terminal, which is generally connected to the wordlines (or to the block select lines, for some embodiments). Theconductance may be modified post-manufacture (i.e., by programming usinga tunneling current; by programming using a hot electron current, etc).The modifiable conductance frequently is manifested as a modifiablethreshold voltage, but may be manifested as a modifiabletransconductance for some technologies.

Another exemplary memory array may implement NAND strings of“polarizable dielectric devices” such as Ferroelectric devices, wherethe device characteristics are modified by applying a voltage on thegate electrode which changes the polarization state of the Ferroelectricgate material.

Another exemplary memory array may implement NAND strings ofprogrammable devices utilizing a floating gate, where the devicecharacteristics are modified by applying a voltage on a control gateelectrode which causes charge to be stored onto the floating gate,thereby changing the effective threshold voltage of the device.

Yet another exemplary memory array may implement NAND strings ofso-called “single electron” devices or “coulomb blockade” devices, whereapplied voltages on the word line change the state of electron trapsformed by silicon nanoparticles or any quantum well structure in thechannel region by which the conduction characteristics of the NANDstring devices are changed. In some embodiments, the structure of thecharge storage region of the NAND string devices could also be locatedin a nanometer sized (i.e., from 0.1 to 10 nanometers) silicon filamentformed at the source or drain edges of the gate structure to modify thedevice characteristic. Other alternative embodiments may utilize anorganic conducting layer for the channel region and form organicmaterial devices in a NAND string whose conductive state is selectivelychanged by applying an appropriate voltage to the word lines.

Thus, while the embodiments described in detail above utilize chargestorage dielectric such as an ONO stack, other memory cells such as afloating gate EEPROM programmed threshold devices, polarizabledielectric devices, single electron or coulomb blockade devices, siliconfilament charge storage devices, and organic material devices are alsocontemplated. Moreover, the invention is not limited to memory arrayshaving positive programming voltages, but is useful for other celltechnologies which may require negative programming pulses. Some of thealternative cell structures allow lower programming voltage. Embodimentswith these lower voltage cells would have proportionally reducedvoltages for the various line nodes such as V_(PASS) and V_(INH) asappropriate to the given cell type.

In various embodiments of the invention described herein, the memorycells may be comprised of semiconductor materials, as described in U.S.Pat. No. 6,034,882 to Johnson et al., U.S. Pat. No. 5,835,396 to Zhang,U.S. patent application Ser. No. 09/560,626 by Knall, and U.S. patentapplication Ser. No. 09/638,428 by Johnson, each of which are herebyincorporated by reference. Specifically an antifuse memory cell ispreferred. Other types of memory arrays, such as MRAM and organicpassive element arrays, may also be used. MRAM (magnetoresistive randomaccess memory) is based on magnetic memory elements, such as a magnetictunnel junction (MTJ). MRAM technology is described in “A 256 kb 3.0V1T1MTJ Nonvolatile Magnetoresistive RAM” by Peter K. Naji et al.,published in the Digest of Technical Papers of the 2001 IEEEInternational Solid-State Circuits Conference, ISSCC 2001/Session7/Technology Directions: Advanced Technologies/7.6, Feb. 6, 2001 andpages 94–95, 404–405 of ISSCC 2001 Visual Supplement, both of which arehereby incorporated by reference. Certain passive element memory cellsincorporate layers of organic materials including at least one layerthat has a diode-like characteristic conduction and at least one organicmaterial that changes conductivity with the application of an electricfield. U.S. Pat. No. 6,055,180 to Gudensen et al. describes organicpassive element arrays and is also hereby incorporated by reference.Memory cells comprising materials such as phase-change materials andamorphous solids can also be used. See U.S. Pat. No. 5,751,012 toWolstenholme et al. and U.S. Pat. No. 4,646,266 to Ovshinsky et al.,both of which are hereby incorporated by reference.

Moreover, while the embodiments described in detail above provide twoconductance values corresponding to two different data states, and thusprovide for storing one bit of information per memory cell, theinvention may also be utilized to provide more than one bit per memorycell. For example, a charge storage dielectric may store charge in anumber of localities. For some structures and programming techniques,the charge may be stored substantially uniformly along the devicechannel length when the programming mechanism acts uniformly along thechannel (e.g., such as by tunneling), or the charge may be stored justat the source or drain edges when a programming mechanism such as hotcarrier injection is used. Multiple bits of information could be storedin each NAND string device by locally storing charge at the source ordrain edge in the case of hot electron programming, single electronmemory devices or silicon filaments located at the source or drainedges. Multiple bits of information could also be stored by injectingseveral different levels of charge into the charge storage medium andassociating different charge levels with different stored states.

In many of the embodiments described above, the block select devices areformed using the same process flow as the memory cells to reduce thenumber of process steps and device structures fabricated at each memorylevel. Thus the block select devices are formed having the samestructure as the memory cells, although they may be sized differently.As used herein, such block select devices may be considered to bestructurally substantially identical to the memory cell devices, eventhough the respective threshold voltages may be programmed or erased todifferent values.

It should be appreciated that the various bias voltages describedherein, including negative voltages and high-voltage programming anderase voltages, may be received from external sources, or may begenerated internally using any of a number of suitable techniques. Itshould also be appreciated that the designations top, left, bottom, andright are merely convenient descriptive terms for the four sides of amemory array. The word lines for a block may be implemented as twointer-digitated groups of word lines oriented horizontally, and theglobal bit lines for a block may be implemented as two inter-digitatedgroups of global bit line oriented vertically. Each respective group ofword lines or global bit lines may be served by a respectivedecoder/driver circuit and a respective sense circuit on one of the foursides of the array. Suitable row and column circuits are set forth in“Multi-Headed Decoder Structure Utilizing Memory Array Line Driver withDual Purpose Driver Device,” U.S. patent application Ser. No.10/306,887, filed Nov. 27, 2002, and in “Tree Decoder StructureParticularly Well Suited to Interfacing Array Lines Having ExtremelySmall Layout Pitch,” U.S. patent application Ser. No. 10/306,888, filedNov. 27, 2002, which applications are hereby incorporated by referencein their entirety. The global bit line may be driven by a bit linedriver circuit, which may be either directly coupled to the global bitline or may be shared among several global bit lines and coupled bydecoding circuitry to a desired global bit line. Suitable driver anddecoder circuits are well known in the art.

As used herein, word lines and bit lines (e.g., including global bitlines) usually represent orthogonal array lines, and follow the commonassumption in the art that word lines are driven and bit lines aresensed, at least during a read operation. Thus, the global bit lines ofan array may also be referred to as sense lines of the array, and mayalso be referred to as simply global array lines (i.e., even thoughother array lines also exist). No particular implication should be drawnas to word organization by use of such terms. Moreover, as used herein,a “global bit line” is an array line that connects to NAND strings inmore than one memory block, but no particular inference should be drawnsuggesting such a global bit line must traverse across an entire memoryarray or substantially across an entire integrated circuit.

The directionality of various array lines in the various figures ismerely convenient for ease of description of the two groups of crossinglines in the array. While word lines are usually orthogonal to bitlines, such is not necessarily required. Moreover, the word and bitorganization of a memory array may also be easily reversed. As anadditional example, portions of an array may correspond to differentoutput bits of a given word. Such various array organizations andconfigurations are well known in the art, and the invention is intendedto comprehend a wide variety of such variations.

It will be appreciated by one skilled in the art that any of severalexpressions may be equally well used when describing the operation of acircuit including the various signals and nodes within the circuit, andno subtle inferences should be read into varied usage within thisdescription. Frequently logic signals are named in a fashion to conveywhich level is the active level. The schematic diagrams and accompanyingdescription of the signals and nodes should in context be clear. As usedherein, two different voltages which are “substantially equal” to eachother have respective values which are close enough to causesubstantially the same effect under the context at issue. Such voltagesmay be assumed to fall within approximately 0.5 volts of each other,unless the context requires another value. For example, a passingvoltage of 5 volts or 5.5 volts may cause substantially the same effectas compared to an inhibit bias voltage of 5 volts, and thus the 5.5 voltpassing voltage may be considered to be substantially identical to the 5volt inhibit voltage.

Regarding power supplies, a single positive power supply voltage (e.g.,a 2.5 volt power supply) used to power a circuit is frequently named the“VDD” power supply. In an integrated circuit, transistors and othercircuit elements are actually connected to a VDD terminal or a VDD node,which is then operably connected to the VDD power supply. The colloquialuse of phrases such as “tied to VDD” or “connected to VDD” is understoodto mean “connected to the VDD node”, which is typically then operablyconnected to actually receive the VDD power supply voltage during use ofthe integrated circuit.

The reference voltage for such a single power supply circuit isfrequently called “VSS.” Transistors and other circuit elements areactually connected to a VSS terminal or a VSS node, which is thenoperably connected to the VSS power supply during use of the integratedcircuit. Frequently the VSS terminal is connected to a ground referencepotential, or just “ground.” Describing a node which is “grounded” by aparticular transistor or circuit (unless otherwise defined) means thesame as being “pulled low” or “pulled to ground” by the transistor orcircuit.

Based upon the teachings of this disclosure, it is expected that one ofordinary skill in the art will be readily able to practice the presentinvention. The descriptions of the various embodiments provided hereinare believed to provide ample insight and details of the presentinvention to enable one of ordinary skill to practice the invention.Nonetheless, in the interest of clarity, not all of the routine featuresof the implementations described herein are shown and described. Itshould, of course, be appreciated that in the development of any suchactual implementation, numerous implementation-specific decisions mustbe made in order to achieve the developer's specific goals, such ascompliance with application- and business-related constraints, and thatthese specific goals will vary from one implementation to another andfrom one developer to another. Moreover, it will be appreciated thatsuch a development effort might be complex and time-consuming, but wouldnevertheless be a routine undertaking of engineering for those ofordinary skill in the art having the benefit of this disclosure.

For example, decisions as to the number of memory cells within eacharray or sub-array, the particular configuration chosen for word lineand bit line pre-decoder and decoder circuits and bit line sensingcircuits, as well as the word organization, are all believed to betypical of the engineering decisions faced by one skilled in the art inpracticing this invention in the context of developing acommercially-viable product. As is well known in the art, various rowand column decoder circuits are implemented for selecting a memoryblock, a NAND string within the selected block, and a memory cell withinthe selected NAND string based upon address signals and possibly othercontrol signals. Similarly, the number of array blocks and the number ofmemory planes are also a matter of engineering decision. Nonetheless,even though a mere routine exercise of engineering effort is believed tobe required to practice this invention, such engineering efforts mayresult in additional inventive efforts, as frequently occurs in thedevelopment of demanding, competitive products.

While circuits and physical structures are generally presumed, it iswell recognized that in modern semiconductor design and fabrication,physical structures and circuits may be embodied in computer readabledescriptive form suitable for use in subsequent design, test orfabrication stages as well as in resultant fabricated semiconductorintegrated circuits. Accordingly, claims directed to traditionalcircuits or structures may, consistent with particular language thereof,read upon computer readable encodings and representations of same,whether embodied in media or combined with suitable reader facilities toallow fabrication, test, or design refinement of the correspondingcircuits and/or structures. The invention is contemplated to includecircuits, related methods or operation, related methods for making suchcircuits, and computer-readable medium encodings of such circuits andmethods, all as described herein, and as defined in the appended claims.As used herein, a computer-readable medium includes at least disk, tape,or other magnetic, optical, semiconductor (e.g., flash memory cards,ROM), or electronic medium and a network, wireline, wireless or othercommunications medium. An encoding of a circuit may include circuitschematic information, physical layout information, behavioralsimulation information, and/or may include any other encoding from whichthe circuit may be represented or communicated.

The foregoing details description has described only a few of the manypossible implementations of the present invention. For this reason, thisdetailed description is intended by way of illustration, and not by wayof limitations. Variations and modifications of the embodimentsdisclosed herein may be made based on the description set forth herein,without departing from the scope and spirit of the invention. It is onlythe following claims, including all equivalents, that are intended todefine the scope of this invention. In particular, even though manyembodiments are described in the context of a three-dimensional memoryarray of TFT memory cells, such limitations should not be read into theclaims unless specifically recited. Moreover, the embodiments describedabove are specifically contemplated to be used alone as well as invarious combinations. Accordingly, other embodiments, variations, andimprovements not described herein are not necessarily excluded from thescope of the invention.

1. An integrated circuit comprising a memory array having at least twoplanes of memory cells formed above a substrate, said memory cellscomprising thin film modifiable conductance switch devices and whichcells are arranged in a plurality of series-connected NAND strings, saidmemory array comprising a first plurality of zias, each of said firstplurality of zias respectively coupling a first end of a respective NANDstring on each of two or more memory planes to a respective global bitline, and said memory array further comprising a second plurality ofzias, each of said second plurality of zias respectively coupling asecond end of a respective NAND string on each of two or more memoryplanes to an associated bias node.
 2. The integrated circuit of claim 1wherein said switch devices include a charge storage dielectric.
 3. Theintegrated circuit of claim 2 wherein said charge storage dielectriccomprises an oxide-nitride-oxide dielectric stack.
 4. The integratedcircuit of claim 1 wherein said switch devices include a floating gateelectrode.
 5. The integrated circuit of claim 1 wherein adjacent NANDstrings are respectively coupled to a respective global bit line by wayof a respective zia structure having a pitch matching that of the NAINI)strings.
 6. The integrated circuit of claim 1 further comprising NANDstrings including a series select device at each end thereof.
 7. Theintegrated circuit of claim 1 wherein the substrate comprises amonocrystalline substrate including circuitry which is coupled to thememory array.
 8. The integrated circuit of claim 1 wherein the substratecomprises a polycrystalline substrate.
 9. The integrated circuit ofclaim 1 wherein the substrate comprises an insulating substrate.
 10. Theintegrated circuit of claim 1 wherein the thin film modifiableconductance switch devices comprise silicon nanoparticles.
 11. Theintegrated circuit of claim 1 wherein the thin film modifiableconductance switch devices comprise a polarizable material.
 12. Theintegrated circuit of claim 1 wherein the thin film modifiableconductance switch devices comprise a ferroelectric material.
 13. Theintegrated circuit of claim 1 wherein the thin film modifiableconductance switch devices comprise transistors having a depletion modethreshold voltage for at least one of two data states.
 14. Theintegrated circuit of claim 1 embodied in computer readable descriptiveform suitable for design, test, or fabrication of the integratedcircuit.
 15. The integrated circuit of claim 1 wherein: adjacent NANDstrings share a single zia coupled to an associated bias node.